PMMI Scholarships

The Chuck Yuska Scholarship was established for PMMI’s former President & CEO of 28 years. Mr. Yuska was an influential force in growing PMMI and the association’s trade show, PACK EXPO, representing innovation in the packaging industry.

This scholarship in the amount of $5,000 is awarded to one student attending a North American 4-year college or university with a focus on electrical engineering.

Established in honor of Packaging Hall of Famer and longtime Enercon Industries Corporation Employee Bill Zito. Enercon is a PMMI Member Company that supplies induction cap sealers,  corona treaters, and plasma surface treaters. Bill Zito was an active PMMI member and strongly believed in the importance of education in the packaging field.

ISBT – International Society of Beverage Technologist is awarding two scholarships of $5,000.  The scholarships include one year of membership in the ISBT and free attendance registration to the ISBT annual meeting, BevTech. (Note: ISBT does not provide sponsorship of travel fees, accommodations or other travel related expenses).

• Students seeking a technical     degree with applicability to the beverage industry. Examples include Food     Science, Engineering, Food Packaging, Biology, Chemistry, Sustainability, etc.

• Minimum GPA of 3.0 (based upon a 4-point scale).

• Beverage Industry involvement or interest. Candidates working in the beverage industry or having a clear path to the beverage industry are preferred.

• Priority given to students attending an ISBT partner schools (Michigan State, Purdue, or Clemson).

The scholarship was established in memory of one of OMAC’s founding members, John A. Kowal, to honor him and his contributions to the field he served for 20+ years – to encourage and support the growth of careers in automation.  This $5,000 scholarship is sponsored by OMAC.

Established in memory of the former president and CEO of the Garvey Corporation, a PMMI Member Company. Mark Garvey was a past chairman of PMMI and a long-time supporter of packaging education. He gave significant time and effort to technical schools in the United States and Canada.

Each fall, the Garvey Family awards the scholarship to one PMMI Partner School that demonstrates a commitment to excellence in the packaging industry.

This scholarship in the amount of $5,000 is awarded to one student attending a North American 4-year college or university with a focus on mechanical engineering or mechanical engineering technology.

The PACK EXPO Scholarship is the beneficiary of PMMI’s PACK gives BACK events at PACK EXPO International and PACK EXPO Las Vegas.  Six $5,000 scholarships are awarded to students attending a North American college or university.

The winners will be announced at the PACK gives BACK event at PACK EXPO.

The PMMI Member Family Scholarship supports immediate family members of PMMI member company employees who are interested in packaging and processing as a career choice. These $5,000 scholarships will be awarded annually to the top fifteen applicants.

This scholarship in the amount of $5,000 is awarded to one student enrolled in a processing program at a North American a 4-year college or university.